Coverbind, the global leader in developing and manufacturing document binding solutions, including thermal binding machines featuring our exclusive Drop&Go Technology, will attend DigiGov Conference on May 3, 2016, in Washington, DC.
Drop by our booth let us show you how our binding efficiency can save your government agency, college, or university print room substantial time and money!
Coverbind will showcase Drop&Go Technology as well as a sampling of our document covers.
Coverbind, the global leader in developing and manufacturing document binding solutions including thermal binding machines featuring our exclusive Drop&Go Technology, will attend the Association of College and University Printers (ACUP) 2016 annual conference.
